MediaTek unveil silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.

Qualcomm’s upcoming Snapdragon 8 Elite 2 has already been rumored to use TSMC’s third-generation 3nm process, known as N3P.

The MediaTek Dimensity 9500 architecture may include a 1+3+4 core layout with a Travis core at 4GHz with a potential AnTuTu ...

Leaked Dimensity 9500 specs reveal an all-big-core design and TSMC N3P process. Get the inside scoop on MediaTek's next flagship chip.

MediaTek has officially confirmed that the Dimensity 9400+ will launch on April 11. It’s a minor refresh of last year’s Dimensity 9400, but the real upgrade is coming with the Dimensity 9500. And if a ...

Taiwan's stock market opened lower on Thursday, mirroring losses on Wall Street, after US President Donald Trump announced a 25% tariff on imported cars and car parts, rattling investor sentiment. The ...

Taiwan stocks weakened Wednesday as TSMC shares declined, with trading volume hitting a 17-month low. The Taiwan Stock ...

It could be a matter of days now. Qualcomm went from Snapdragon 8 Gen 3 to Snapdragon 8 Elite last year, and so, for a long ...

Right now, chipmakers are building the best smartphone chipsets in the world using the 3nm process. This includes Apple’s A18 ...

Realme Narzo 80 Pro 5G is all set to be launched in India. The new Narzo series smartphone hasn’t been announced by Realme ...