Diffusion barriers based on Ta and Ti related materials have been used in Cu interconnect technology to mitigate Cu diffusion into damascene structures. Along with the scaling of VLSI circuits, Cu ...

When a drummer hits a drum, the surface vibrates and creates sound—a signal we recognize as music. But once those vibrations ...

Apple's thinnest iPhone ever teased again with a new video of the iPhone 17 Air, with a dummy model giving us our best look ...