However, current encapsulations cannot work at temperature above 175°C, making high-temperature (≥250°C) packaging of SiC devices still a challenge. This article introduces an innovative ...

“The launch of Variscite’s new System on Module, powered by TI’s AM62P SoC, enhances our VAR-SOM Pin2Pin family with a cost-optimized solution featuring advanced multimedia capabilities and ...

Airbus is looking forward to manufacturing parts for a large group of A400M aircraft in the UAE, said Gabriel Simellas, President of Airbus Africa and Middle East. This step will contribute to the ...

Credit: GE Aerospace As a pilot, I never really thought twice about where the parts on my aircraft came from ... to discuss challenges and to seek solutions. In October the coalition released ...

More than 100 Western companies, including aerospace giant Boeing, exported aircraft parts to India, which then ended up in Russia. Points of attention Over 100 Western companies, including Boeing, ...

This capability becomes increasingly important as more devices compete for limited wireless spectrum. WiFi chip design continues growing and is projected to reach $36.8 billion at 4% CAGR by 2034.

EHang, JAC Motors and Guoxian Holdings will conduct joint research on the automation of aircraft production technologies and build a manufacturing base, all to accelerate low-altitude aviation ...