However, current encapsulations cannot work at temperature above 175°C, making high-temperature (≥250°C) packaging of SiC devices still a challenge. This article introduces an innovative ...
“The launch of Variscite’s new System on Module, powered by TI’s AM62P SoC, enhances our VAR-SOM Pin2Pin family with a cost-optimized solution featuring advanced multimedia capabilities and ...
Airbus is looking forward to manufacturing parts for a large group of A400M aircraft in the UAE, said Gabriel Simellas, President of Airbus Africa and Middle East. This step will contribute to the ...
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